Wolanski, Philippe: search on Z-Library

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1

Measurement and determinants of infrarenal aortic thrombus volume

Jonathan Golledge, Philippe Wolanski, Adam Parr, Petra Buttner

Journal:

European Radiology

Year:

2008

Language:

english

File:

PDF, 202 KB

english, 2008

2

Preliminary results of robot-assisted laparoscopic radical prostatectomy (RALP) after fellowship training and experience in laparoscopic radical prostatectomy (LRP)

Wolanski, Philippe, Chabert, Charles, Jones, Lee, Mullavey, Tarryn, Walsh, Sharon, Gianduzzo, Troy

Journal:

BJU International

Year:

2012

Language:

english

File:

PDF, 416 KB

english, 2012

3

Metastatic prostate cancer incidence in Australia after amendment to prostate-specific antigen screening guidelines

Smith, Sabin, Wolanski, Philippe

Journal:

ANZ Journal of Surgery

Year:

2017

Language:

english

File:

PDF, 440 KB

english, 2017

4

(Invited) Si 1-x Ge x /Si MQW Based Uncooled Microbolometer Development and Integration into 130 nm BiCMOS Technology

Baristiran Kaynak, Canan, Yamamoto, Yuji, Göritz, Alexander, Korndoerfer, Falk, Zaumseil, Peter, Kulse, Philipp, Schulz, Katrin, Fraschke, Mirko, Marschmeyer, Steffen, Wolansky, Dirk, Wietstruck, Matt

Journal:

ECS Transactions

Year:

2018

Language:

english

File:

PDF, 862 KB

english, 2018

5

The transport and fate of riverine fine sediment exported to a semi-open system

Delandmeter, Philippe, Lewis, Stephen E., Lambrechts, Jonathan, Deleersnijder, Eric, Legat, Vincent, Wolanski, Eric

Journal:

Estuarine, Coastal and Shelf Science

Year:

2015

Language:

english

File:

PDF, 2.13 MB

english, 2015

6

Submesoscale tidal eddies in the wake of coral islands and reefs: satellite data and numerical modelling

Delandmeter, Philippe, Lambrechts, Jonathan, Marmorino, George O., Legat, Vincent, Wolanski, Eric, Remacle, Jean-François, Chen, Wei, Deleersnijder, Eric

Journal:

Year:

2017

Language:

english

File:

PDF, 6.38 MB

english, 2017

7

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Development of a Through-Silicon Via (TSV) Process Module for Multi-project Wafer SiGe BiCMOS and Silicon Interposer

Wietstruck, Matthias, Marschmeyer, Steffen, Kulse, Philipp, VoB, Thomas, Lisker, Marco, Kruger, Andreas, Wolansky, Dirk, Fraschke, Mirko, Kaynak, Mehmet

Year:

2018

Language:

english

File:

PDF, 3.81 MB

english, 2018

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